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  • BYK-3440

    Surface additive for solvent-borne, solvent-free and aqueous systems with a strong reduction in the surface tension. Good wetting of critical substrates. No influence on surface slip.

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  • BYK-3441

    Polyacrylate-based surface additive for solvent-borne and aqueous systems to improve leveling.

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  • BYK-345

    Silicone surfactant for aqueous coatings, printing inks, and paper coatings with a strong reduction of surface tension.

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  • BYK-345

    Silicone surfactant for aqueous coatings, printing inks and overprint varnishes with strong reduction in surface tension resulting in significantly improved substrate wetting. No increase in surface slip. Solvent-free version of BYK-346.

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  • BYK-3450

    Silicone surfactant for aqueous printing inks, inkjet inks and overprint varnishes which significantly reduces surface tension.

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  • BYK-3451

    Silicone surfactant for aqueous printing inks, inkjet inks and overprint varnishes which significantly reduces surface tension.

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  • BYK-3455

    Fluorine-free, silicone-containing additive for improving substrate wetting and leveling in aqueous systems and solvent-free UV coatings.

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  • BYK-3455

    Fluorine-free substrate wetting and leveling additive for aqueous systems and UV coatings with a strong reduction of the dynamic and static surface tension and an improvement of leveling properties.

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  • BYK-346

    Silicone surfactant for aqueous coatings, printing inks, and paper coatings with a significant reduction of surface tension.

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  • BYK-347

    Silicone surfactant for aqueous coatings, printing inks, and paper coatings with a strong reduction of surface tension.

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  • BYK-347

    Silicone surfactant for aqueous coatings, printing inks and overprint varnishes with a considerable reduction in the surface tension and therefore an improvement in the substrate wetting. Does not increase the surface slip.

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  • BYK-348

    Silicone surfactant for aqueous coatings, adhesives, printing inks and overprint varnishes with a considerable reduction in the surface tension and therefore an improvement in the substrate wetting. Does not increase the surface slip. Suitable for systems that do not contain co-solvents.

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