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Plastics Additives

Showing 13 to 24 of 189 products
  • HORDAMER PE 02

    Primary PE dispersion for aqueous mould release agents used in aluminum die casting. Anti-caking additive for thermoplastics and hotmelts.

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  • ANTI-TERRA-204

    Controlled flocculating wetting and dispersing additive for solvent-borne non-polar thick layer systems and primers to prevent fillers and inorganic pigments from settling and to gel bentonites. Particularly suitable for non-polar systems, e.g. alkyd systems. The additive may cause viscosity increas

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  • BYK-A 515

    Silicone-free air release additive on polymer-basis for solvent-free and solvent-borne epoxy and PUR systems as well as adhesives. Improves fibre wetting. For highly thixotropic gel coats and acrylic syrup. Often used in combination with BYK-A 555 or BYK-A 501.

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  • BYK-A 530

    Silicone polymer air release additive for solvent-free and solvent-borne epoxy systems and adhesives with good air-releasing and defoaming effects.

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  • BYK-A 535

    Silicone-free air release additive for solvent-free and solvent-borne epoxy and PUR systems as well as adhesives. Particularly suitable for systems with food contact, e.g. coating for tank interiors. May affect transparency.

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  • BYK-A 555

    Highly efficient silicone-free air release additive on polymer-basis for solvent-free and solvent-borne UP systems and adhesives. Suitable for all types of UP resins and processing methods.

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  • BYK-A 560

    Silicone-free polymer-based air release additive for solvent-free unsaturated polyester systems, gel coats and cast resins. It is recommended for all glass fiber reinforced, unsaturated polyester applications. It is also recommended for pultrusion applications with acrylic, unsaturated polyester and

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  • BYK-P 9050

    Processing additive for thermosetting UP-based compounds for BMC with excellent release properties. The additive improves surface properties and reduces fogging in the finished components.

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  • BYK-P 9051

    Processing additive for thermosetting UP-based compounds for BMC with excellent release properties. The additive improves surface properties and reduces fogging in the finished components. Low-viscosity version of BYK-P 9050.

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  • BYK-P 9060

    Processing additive for thermosetting UP-based compounds for SMC with excellent release properties. Used in low-shrink SMC applications to improve flow behaviour and surface properties.

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  • BYK-P 9065

    Processing additive for thermosetting UP-based compounds for SMC with excellent release properties. Used in low-shrink SMC applications to improve flow behaviour and surface properties. Efficient at low doses.

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  • BYK-P 9080

    Processing additive for thermosetting UP-based compounds for SMC with excellent release properties. Used in low-profile, class A SMC applications to improve flow behaviour and surface properties.

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